Industrial motherboards · Shenzhen
Engineered to the trace.
28 boards, six footprints, one line. Wide temperatures, unregulated DC power, the long shift. From one sample to OEM/ODM, the engineer who answers the RFQ stays on the thread.
01 · The lineup
Six form factors. One system.
Start from the enclosure, not the CPU. Every family shares the same industrial parts discipline, so a bigger size does not mean a new qualification.
All 28 motherboards
ITX660B
Mini-ITX
170 × 170 mm · LGA1700 to Core Ultra
Socketed LGA1700 at 65W or onboard Core Ultra, with dual DDR5, six COM and PCIe depth.
AD742A
2.5-inch SBC
100 × 72 mm
N150 to Core Ultra in the smallest bay.
UT100NU
NANO-ITX
120 × 120 mm
28W Core Ultra, 96GB DDR5, 120mm square.
UT1003AW
3.5-inch SBC
146 × 102 mm · Core Ultra 15W / 28W
Core Ultra at 15W or 28W, dual 2.5G, 96GB DDR5 and six COM.
HK800CA
NUC
100 × 100 mm
Ryzen AI or Core Ultra, 100mm square.
TL500Z3AW
3.5-inch Wide
155 × 117 mm
Six COM, CAN, LPT and wide DC input.
02 · Wide-range engineering
Built for environments that aren’t climate-controlled.
Plant floors, vehicle cabs and sealed cabinets. The range is chosen for those conditions, then tested per model.
Test sample per model · burn-in every production batch
03 · In the field
Deployed where the power isn’t clean.
Board configurations are matched per application, with industrial-spec silicon and long-life support.
All 7 industry routes
Factory Automation
Vision, motion and MES nodes with the serial ports the line still needs.
Medical Devices
Quiet, fanless boards sized for certification cycles that run for years.
Kiosk & POS
Peripheral-heavy terminals that reboot when nobody is watching.
Transportation
On-board computers riding 12/24V vehicle power over 4G.
Digital Signage
Dual 4K players with remote restart for public screens.
Edge AI & Security
Inference and NVR nodes with M.2 accelerators and 4G backhaul.
Energy & Communication
Utility and telecom gateways that keep talking when cabinet air runs hot.
04 · At a glance
Pick the floor plan.
Representative figures per form factor. Model specs live on the product pages.
28 models · 6 form factors
Six footprints compared
Board size, platform class and expansion at a glance. Ratings differ by model, so confirm the configuration before design freeze.
Swipe to compare →| Form factor | Board size | Typical CPU class | Network & expansion |
|---|---|---|---|
| 2.5-inch SBC | 100 × 72 mm | Alder Lake-N to Core Ultra 28W | 1× 2.5G LAN · M.2 2242 · LVDS / eDP · soldered LPDDR5 |
| 3.5-inch SBC | 146 × 102 mm | Core Ultra 15W / 28W, Tiger Lake-U | 2× 2.5G LAN · 6× COM · M.2 2280 · DC 9-36V |
| Mini-ITX | 170 × 170 mm | LGA1700 65W, onboard Core Ultra 28W | 2× GbE or 2.5G LAN · DDR5 · 6× COM · PCIe slot |
| NANO-ITX | 120 × 120 mm | Alder Lake-N 6W to Core Ultra 28W | Up to 4× LAN · M.2 2280 · 2× DDR5 SO-DIMM |
| NUC | 100 × 100 mm | Core Ultra, Ryzen AI or Ryzen 7000 | 2× 2.5G LAN · 2× HDMI · M.2 2280 · DC 12-19V |
| 3.5-inch Wide | 155 × 117 mm | Tiger Lake-U or 12th/13th Gen U/P | 2× LAN · 6× COM · CAN · LPT · DC 9-36V |
Source: current model datasheets
Open the full lineup05 · How it works
From your drawing to the dock.
The RFQ, the sample and the production batch share one thread and one factory address. Four checkpoints, no distributor handoff.
Talk to an engineerSend the brief
Model or requirement list, quantity and destination. One page is enough.
Engineer review
Power, temperature, I/O and enclosure checked by the engineer who owns the line.
Sample, MOQ 1
One to three units for bench and enclosure validation before production.
Build, test, ship
Batch burn-in, outgoing QC and FOB Shenzhen. T/T or L/C, export packing.
One roof · Shenzhen
Six stages. One accountable address.
SMT, assembly, functional test, burn-in, outgoing QC and packing run in the same building. The engineer on your RFQ sits a corridor from the line.
06 · Documents, not promises
The paperwork follows the board.
Platform certificates for CE EMC, FCC SDoC and EU RoHS are on file. Per-model documents come with the order.
CE EMC
FCC SDoC
EU RoHS
Scans of the current platform. Model and market documents come with the order.
07 · Before you commit
Questions that come before the PO.
Samples, customisation and where the boards are built.
Read all FAQsOne piece for standard models. Most evaluations use two or three: bench, prototype enclosure and a spare. Samples ship in 2 to 5 days.
Start a project
Tell us the environment. We’ll close the loop.
Send model numbers or a requirement list. A product engineer matches the board and confirms availability.
GEOLiNK / Shenzhen