3.5-inch SBC · 146×102 MM · R100
RP7003AW Industrial Motherboard
12th/13th Gen Core U/P with DDR5 to 96 GB, a PCIe 5.0 M.2 slot and two 40 Gbps Type-C ports, the RP7003AW packs machine-vision compute into a 146×102 mm industrial board.
- CPU
- Onboard Core 12th/13th Gen -U/-P
- Memory
- 2× DDR5 SO-DIMM · 96GB
- Display
- DP 1.4 · HDMI 2.0 · 2× Type-C (DP)
- Network
- 2× Intel i226-V LAN
- Power
- DC 9–36V · 120W
- Temperature
- −20/+60°C operating
Sample MOQ 1 pc · reply within 24–48 h · FOB Shenzhen
Why RP7003AW
Where it outruns the spec sheet
The details below are the ones buyers check before a sample order.
Storage
PCIe 5.0 x4 M.2
The M-Key 2280 slot runs PCIe 5.0 x4, image sets, inference caches and logs move without becoming the bottleneck.
USB-C
Two Type-C, 40Gbps
Both Type-C ports carry DP alternate mode at up to 40 Gbps, display and high-speed data on one connector, twice over.
Memory
DDR5 to 96GB
2× DDR5 SO-DIMM: 64 GB on 12th Gen, 96 GB on 13th, headroom for vision buffers and containerized edge apps.
Motion
Six COM + two CAN
COM1/2 switch RS232/485 in BIOS, COM3–6 stay RS232; 8-bit GPIO and 2× CAN headers keep motion control off USB hubs.
Full specifications
Technical data
Per the RP7003AW English specification sheet, R100. Values can be verified against the datasheet on request.
| CPU | Onboard Intel Core 12th/13th Generation -U/-P series · EFI BIOS |
|---|---|
| Memory | 2× DDR5 SO-DIMM · up to 64 GB (12th Gen) / 96 GB (13th Gen) |
| Storage | 1× M.2 2280 (PCIe 5.0 x4) · 1× SATA 3.0 (2-pin 5V power) |
| Display | 1× DP 1.4 · 1× HDMI 2.0 · 2× Type-C (DP alt mode, up to 40 Gbps) · 1× LVDS/eDP optional |
| Network | 2× Intel i226-V LAN · E-Key WiFi/BT · B-Key 4G/5G or SSD |
| USB | 2× USB 3.0 · USB 3.0 + Type-C (DP + 40 Gbps) · Type-C (DP + 40 Gbps) · 2× USB 2.0 headers |
| Serial | 6× COM · COM1/2 RS232/RS485 (BIOS selectable) · COM3–6 RS232 |
| Expansion | 1× E-Key (PCIe + USB 2.0, WiFi/BT) · 1× B-Key (USB 2.0 + USB 3.0 + PCIe, 4G/5G/SSD) |
| Other I/O | 8-bit GPIO header · 2× CAN · 4-pin PWM CPU fan · 3-pin system fan |
| Security | External TPM 2.0 optional (not installed by default) |
| Power | DC 9–36V · 120 W |
| Dimensions | 102 × 146 mm · ~120 g without heatsink · ~220 g with |
| Environment | −20°C to +60°C operating · −40°C to +85°C storage · 5–90% RH, non-condensing |
| Software | Windows 10 · Windows 11 · Linux |
Need a port count that is not listed? Ask the engineer who owns the datasheet.
Ask about RP7003AWConfiguration
Ordering options
Options are configured at order time against the standard base board.
| Option | Standard | Optional |
|---|---|---|
| CPU SKU | Intel Core 12th/13th Gen -U/-P series (selectable models) | |
| Panel output | LVDS / eDP (optional) | |
| Security | External TPM 2.0 (not installed by default) | |
Product photos
RP7003AW, every angle
Board, I/O and mounting views from the current production sample.
Where It Fits
Machine vision and edge computing
The RP7003AW fits where compute, storage and camera data meet on a single industrial board. Typical deployments:
PCIe 5.0 NVMe and DDR5 feed inspection pipelines; dual i226-V LAN carries camera streams while COM reaches the PLC.
B-Key 4G/5G plus SIM keep cabinets reachable; optional external TPM 2.0 secures the node; DC 9–36 V rides site rails.
DP 1.4, HDMI 2.0 and two Type-C drive multi-screen self-service and operator interfaces.
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Family
All 3.5-inch SBC boards
4 boards share the 146 × 102 mm footprint. Compare I/O, platform and power before you commit.
View the lineupStart a project
Quote the RP7003AW for your build.
Send the enclosure, the environment and the interfaces you need. An engineer replies within 24 to 48 hours with a model, a lead time and a price.
GEOLiNK / Shenzhen